OptiML™ technology is breakthrough wafer-level camera (WLC) technology designed to significantly advance the integration of miniaturized cameras in mobile phones, personal computers, security cameras and other portable electronic devices.
Based on wafer-level processing, the OptiML™ WLC technology makes it possible for cameras to be manufactured at the wafer level, dramatically reducing the size and total bill of materials cost of camera modules.
With OptiML WLC technology, thousands of lenses are built simultaneously on a wafer. The lens wafers are then aligned and bonded at the wafer level using WaferStack™ technology. The bonded lens wafers are then diced into individual, integrated optical elements that can be mounted onto a packaged image sensor. The accuracy of the wafer stack process eliminates the need for costly manual focusing.
APPLICATIONS
Mobile Phones
PDA
Laptops
Security Cameras
Automobiles
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