MEMS microphone encapsulation structure
申請公佈號：CN106604190A
申請人：无锡红光微电子股份有限公司
Abstract
The invention provides an MEMS microphone encapsulation structure. With the structure adopted, the back cavity volume of MEMS microphones is increased, and the sensitivity and signal-to-noise ratio of MEMS microphones are increased. The MEMS microphone encapsulation structure comprises a PCB, and further comprises a metal shell, an MEMS chip, and an ASIC chip. The metal shell is arranged on the PCB, an inner cavity is formed between the metal shell and the PCB, and the metal shell has a through hole. The MEMS chip is arranged on the metal shell, the back cavity of the MEMS chip directly faces the through hole, and the back cavity of the MEMS chip is communicated with the inner cavity via the through hole. The ASIC chip is electrically connected with the MEMS chip and the PCB through wires.
PCB 1
metal case 2
internal cavity plate 3
housing 4
MEMS chip 5
ASIC chip 6
electrical lines 7
metal shell 8
sound hole 9
outer chamber 10
Capacitor 11
[VIA]
MEMS microphone encapsulation structure
申請公佈號：CN106604190A
申請人：无锡红光微电子股份有限公司
Abstract
The invention provides an MEMS microphone encapsulation structure. With the structure adopted, the back cavity volume of MEMS microphones is increased, and the sensitivity and signal-to-noise ratio of MEMS microphones are increased. The MEMS microphone encapsulation structure comprises a PCB, and further comprises a metal shell, an MEMS chip, and an ASIC chip. The metal shell is arranged on the PCB, an inner cavity is formed between the metal shell and the PCB, and the metal shell has a through hole. The MEMS chip is arranged on the metal shell, the back cavity of the MEMS chip directly faces the through hole, and the back cavity of the MEMS chip is communicated with the inner cavity via the through hole. The ASIC chip is electrically connected with the MEMS chip and the PCB through wires.
PCB 1
metal case 2
internal cavity plate 3
housing 4
MEMS chip 5
ASIC chip 6
electrical lines 7
metal shell 8
sound hole 9
outer chamber 10
Capacitor 11
[VIA]
MEMS microphone encapsulation structure
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