Title: Sound transducer with housing and MEMS structure
US Patent: 10,231,061
Assignee: Infineon Technologies AG
Abstract:
A sound transducer includes a housing with a sound port and a MEMS structure disposed in an interior space of the housing. The MEMS structure and the sound port are acoustically coupled to each other. The MEMS structure separates a front volume from a back volume of the housing. At least one vent hole of the MEMS structure allows a gas exchange between the front volume and the back volume. The sound port allows a liquid to enter the front volume. Further, the MEMS structure prevents liquid from entering the back volume.
Housing 1
MEMS structure 2
Front volume 11
Back volume 12
Sound port 13
Vent hole 20
Diaphragm 21
Surface 22
Hydrophobic structure 23
VIA USPTO
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