Smart Equipment Technology

You are looking for a Die Bonder or a Flip Chip Bonder able to align and bond small and fragile components at less than 1 µm post bond accuracy?

From fluxless reflow, through most types of adhesives to thermocompression, the SET chip-to-chip and chip-to-wafer bonding platforms can be adapted to all bonding technologies.

The very high accuracy and flexible progamming, combined with the potential for using several bonding methods, gives you the benefit of a very quick path finding and process reliability optimization.

As a Supplier of semiconductor equipment dedicated to high precision applications for over 30 years SET has delivered over 2500+ systems and developed over 30 different types of equipment. First introduced in 1981, the Device bonder became the primary focus of the company in 1997. With an installed base of more than 250 Device Bonders worldwide, SET is globally renowned for the unsurpassed post bonding accuracy and the flexibility of its systems. SET is a wholly owned subsidiary of Replisaurus Technologies.

國外廠商，若是需要封裝機台，可以找他們，但.......在法國

FROM HERE
Smart Equipment Technology