微機電與感測器的全球商機及技術革新

Application of microsystems for comfort control


Title: Application of microsystems for comfort control     
US. Patent: 7,854,389
Assignee: Siemens Industry Inc.
Abstract: An arrangement includes a plurality of wireless microsystems. Each microsystem is operable to measure at least relative humidity and temperature, and to communicate temperature and relative humidity information wirelessly to a network device. The network device is operable to communicate the temperature and relative humidity information to at least a first processor configured to cause a change in a building control condition based on the information. 

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