Abstract
A fabrication process for the simultaneous shaping of arrays of glass shells on a wafer level is introduced in this paper. The process is based on etching cavities in silicon, followed by anodic bonding of a thin glass wafer to the etched silicon wafer. The bonded wafers are then heated inside a furnace at a temperature above the softening point of the glass, and due to the expansion of the trapped gas in the silicon cavities the glass is blown into threedimensional
spherical shells. An analytical model which can be used to predict the shape of the glass shells is described and demonstrated to match the experimental data. The ability to blow glass on a wafer level may enable novel capabilities including mass-production of microscopic spherical gas confinement chambers, microlenses, and complex microfluidic networks.
A fabrication process for the simultaneous shaping of arrays of glass shells on a wafer level is introduced in this paper. The process is based on etching cavities in silicon, followed by anodic bonding of a thin glass wafer to the etched silicon wafer. The bonded wafers are then heated inside a furnace at a temperature above the softening point of the glass, and due to the expansion of the trapped gas in the silicon cavities the glass is blown into threedimensional
spherical shells. An analytical model which can be used to predict the shape of the glass shells is described and demonstrated to match the experimental data. The ability to blow glass on a wafer level may enable novel capabilities including mass-production of microscopic spherical gas confinement chambers, microlenses, and complex microfluidic networks.
利用微機電技術所製作之透鏡，其中球面之尺寸為700um，而晶粒之大小為2mm x 2mm。此利鏡製作之方式，為利用吹泡泡之原理來產生透鏡。所完成之透鏡，可應用於手機之鏡頭，或是MEMS技術製作之光學平台中。
FROM HERE
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, E. Jesper Eklund, Student Member, IEEE, and Andrei M. Shkel
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