Abstract
Various three-dimensionally (3-D) complex MEMS structures are fabricated using multidirectional ultraviolet (UV) lithography, which includes reverse-side exposure through a UV-transparent substrate, inclined exposure with or without simultaneous substrate rotation, and the combination of these processes. A reverse-side exposure scheme through UV-transparent substrates (e.g., glass, sapphire, or quartz) has been exploited for implementing high-aspect-ratio structures (greater than 20:1), repeatable self-alignment photoresist patterning with subsequent metallization on a BST/sapphire substrate, and unconventional patterning using substrate optics such as proximity patterning or integrated lens techniques. Inclined exposure has been applied to a SU-8 substrate with differing inclination angles and incidence directions. The refractive index of SU-8 is experimentally determined to be 1.68 by means of test structures fabricated using this approach. Implemented structures using the inclined exposure include vertical screen structures, inclined tubes, and conical shape structures. Dynamic mode operation, in which the substrate is continuously rotated and tilted during exposure is also discussed. Examples of achievable 3-D structures using dynamic mode operation are presented.
利用紫外光技術所製作的3D結構，改變將要曝光的晶圓的角度而達成或是改變曝光角度，很多奇奇怪怪的形狀。
FROM HERE
Yong-Kyu Yoon, Jung-Hwan Park, and Mark G. Allen, "Multidirectional UV Lithography for Complex 3-D MEMS Structures",JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 15, NO. 5, OCTOBER 2006.
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